{"id":55,"date":"2025-12-24T15:28:22","date_gmt":"2025-12-24T07:28:22","guid":{"rendered":"http:\/\/8.217.15.65\/?p=55"},"modified":"2026-01-14T17:06:35","modified_gmt":"2026-01-14T09:06:35","slug":"semiconductor-equipment-ceramic-robot-arm","status":"publish","type":"post","link":"https:\/\/www.xycmat.com\/de\/successful-case\/semiconductor-industry\/semiconductor-equipment-ceramic-robot-arm\/","title":{"rendered":"Wafer-Handling-Finger"},"content":{"rendered":"

<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

Produktmerkmale - Keramik-Roboterarme f\u00fcr Halbleiteranlagen<\/strong><\/h1>\n\n\n\n

Wafer-Handling-Finger<\/strong><\/h2>\n\n\n\n

Mechanische Keramikarme, auch bekannt als keramische Roboterfinger, Wafertr\u00e4ger oder keramische Handhabungsarme, werden haupts\u00e4chlich in Halbleiteranlagen f\u00fcr den Transport und die \u00dcbergabe von Wafern verwendet. Sie fungieren als \"H\u00e4nde\" von Robotern in Halbleiteranlagen und sind f\u00fcr die pr\u00e4zise Bewegung kreisf\u00f6rmiger Siliziumwafer an bestimmte Positionen verantwortlich.<\/p>\n\n\n\n

Produktmerkmale<\/strong><\/p>\n\n\n\n

    \n
  1. Hohe Produktpr\u00e4zision<\/li>\n\n\n\n
  2. Ausgezeichnete Luftdichtheit<\/li>\n\n\n\n
  3. Gute Hochtemperaturbest\u00e4ndigkeit<\/li>\n\n\n\n
  4. Kontrollierbarer Oberfl\u00e4chenwiderstand<\/li>\n\n\n\n
  5. Hohe Best\u00e4ndigkeit gegen S\u00e4uren, Laugen und Korrosion, geeignet f\u00fcr extrem raue Umgebungen<\/li>\n<\/ol>\n\n\n\n

    \u25b2 Selbstabdichtungstest: Schalten Sie die Vakuumluftquelle aus; halten Sie einen Unterdruck von -85 kPa bis -80 kPa f\u00fcr mehr als 60 Sekunden aufrecht.
    \u25b2 Adsorptionstest f\u00fcr Wafer: Schalten Sie die Vakuumluftquelle aus; halten Sie einen Unterdruck von -80 kPa bis -25 kPa f\u00fcr mehr als 35 Sekunden aufrecht.<\/p>\n\n\n\n

    <\/p>\n\n\n\n

      \n
    • Hochdimensionale Pr\u00e4zision<\/strong>: Sorgt f\u00fcr eine genaue Handhabung und Positionierung der Wafer, die f\u00fcr fortschrittliche Halbleiterprozesse entscheidend sind.<\/li>\n\n\n\n
    • Au\u00dfergew\u00f6hnliche Luftdichtheit<\/strong>: Sorgt f\u00fcr stabile Vakuumbedingungen w\u00e4hrend des Wafertransfers und minimiert das Kontaminationsrisiko.<\/li>\n\n\n\n
    • Hervorragende Best\u00e4ndigkeit gegen Hochtemperaturen<\/strong>: Geeignet f\u00fcr Prozessumgebungen mit hohen Temperaturen ohne Verformung oder Leistungseinbu\u00dfen.<\/li>\n\n\n\n
    • Kontrollierbarer Oberfl\u00e4chenwiderstand<\/strong>: Der spezifische Widerstand erm\u00f6glicht eine elektrostatische Kontrolle und verhindert die Ansammlung von Ladungen zum Schutz empfindlicher Wafer.<\/li>\n\n\n\n
    • Hervorragende chemische Best\u00e4ndigkeit<\/strong>: Hochgradig resistent gegen starke S\u00e4uren, Laugen und korrosive Prozessgase - ideal f\u00fcr raue Umgebungen bei der Halbleiterherstellung.<\/li>\n<\/ul>\n\n\n\n

      Leistungsvalidierungstests<\/strong>
      \u25b2 Selbstversiegelungstest<\/strong>: Wenn die Vakuumquelle ausgeschaltet ist, h\u00e4lt der Arm einen Unterdruck von -85 kPa bis -80 kPa f\u00fcr mehr als 60 Sekunden<\/strong>.
      \u25b2 Wafer-Halte-Test<\/strong>: Bei ausgeschalteter Vakuumquelle h\u00e4lt es einen Unterdruck von -80 kPa bis -25 kPa f\u00fcr mehr als 35 Sekunden<\/strong>und sorgt f\u00fcr einen zuverl\u00e4ssigen Halt der Wafer.<\/p>\n\n\n\n

      Wichtige Leistungsdaten<\/strong><\/p>\n\n\n\n

      Parameter<\/th>Einheit<\/th>Siliziumkarbid (SiC)<\/th>Aluminiumoxid (Al\u2082O\u2083)<\/th><\/tr><\/thead>
      Widerstandsf\u00e4higkeit der Oberfl\u00e4che<\/td>\u03a9<\/td>1 \u00d7 10\u2075<\/td>1 \u00d7 10\u00b9\u2074<\/td><\/tr>
      Max. Betriebstemperatur (geteilter Arm)<\/td>\u00b0C<\/td>350<\/td>350<\/td><\/tr>
      Max. Betriebstemperatur (integrierter Arm)<\/td>\u00b0C<\/td>800<\/td>800<\/td><\/tr>
      Adsorption Oberfl\u00e4chenrauhigkeit (Ra)<\/td>\u03bcm<\/td>0.01<\/td>0.01<\/td><\/tr>
      Adsorption Ebenheit der Oberfl\u00e4che<\/td>mm<\/td>0.01<\/td>0.01<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

      Hinweis: Alle Werte geben die typische Leistung unter Standard-Reinraum- und Prozessbedingungen wieder.<\/em><\/p>\n\n\n\n

      <\/p>","protected":false},"excerpt":{"rendered":"

      Produktmerkmale - Keramische Roboterarme f\u00fcr Halbleiteranlagen Wafer-Handling-Finger Mechanische Keramikarme, auch bekannt als keramische Roboterfinger, Wafer-Carrier oder keramische Handling-Arme, werden haupts\u00e4chlich in Halbleiteranlagen f\u00fcr den Transport und die \u00dcbergabe von Wafern eingesetzt. Sie fungieren als \"H\u00e4nde\" von Robotern in Halbleiteranlagen und sind f\u00fcr die pr\u00e4zise Bewegung kreisf\u00f6rmiger Siliziumwafer zu [...]<\/p>","protected":false},"author":1,"featured_media":156,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[58,53],"tags":[],"class_list":["post-55","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-semiconductor-industry","category-successful-case"],"yoast_head":"\nwafer handling finger - XYC<\/title>\n<meta name=\"description\" content=\"Ceramic mechanical arms, also known as ceramic robotic fingers, wafer carriers, or ceramic handling arms, are primarily used in semiconductor equipment for transporting and transferring wafers. They function as the "hands" of semiconductor equipment robots, responsible for precisely moving circular silicon wafers to designated positions.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.xycmat.com\/de\/successful-case\/semiconductor-industry\/semiconductor-equipment-ceramic-robot-arm\/\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.xycmat.com\/successful-case\/semiconductor-industry\/semiconductor-equipment-ceramic-robot-arm\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.xycmat.com\/successful-case\/semiconductor-industry\/semiconductor-equipment-ceramic-robot-arm\/\"},\"author\":{\"name\":\"XYCeramic_Solutions\",\"@id\":\"https:\/\/www.xycmat.com\/#\/schema\/person\/f0d1f9b83d8b0f982658f15f87a08f10\"},\"headline\":\"wafer handling finger\",\"datePublished\":\"2025-12-24T07:28:22+00:00\",\"dateModified\":\"2026-01-14T09:06:35+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.xycmat.com\/successful-case\/semiconductor-industry\/semiconductor-equipment-ceramic-robot-arm\/\"},\"wordCount\":301,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\/\/www.xycmat.com\/#organization\"},\"image\":{\"@id\":\"https:\/\/www.xycmat.com\/successful-case\/semiconductor-industry\/semiconductor-equipment-ceramic-robot-arm\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.xycmat.com\/wp-content\/uploads\/2025\/12\/4144.jpg\",\"articleSection\":[\"Semiconductor industry\",\"Success Cases\"],\"inLanguage\":\"de\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\/\/www.xycmat.com\/successful-case\/semiconductor-industry\/semiconductor-equipment-ceramic-robot-arm\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.xycmat.com\/successful-case\/semiconductor-industry\/semiconductor-equipment-ceramic-robot-arm\/\",\"url\":\"https:\/\/www.xycmat.com\/successful-case\/semiconductor-industry\/semiconductor-equipment-ceramic-robot-arm\/\",\"name\":\"wafer handling finger - XYC\",\"isPartOf\":{\"@id\":\"https:\/\/www.xycmat.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.xycmat.com\/successful-case\/semiconductor-industry\/semiconductor-equipment-ceramic-robot-arm\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.xycmat.com\/successful-case\/semiconductor-industry\/semiconductor-equipment-ceramic-robot-arm\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.xycmat.com\/wp-content\/uploads\/2025\/12\/4144.jpg\",\"datePublished\":\"2025-12-24T07:28:22+00:00\",\"dateModified\":\"2026-01-14T09:06:35+00:00\",\"description\":\"Ceramic mechanical arms, also known as ceramic robotic fingers, wafer carriers, or ceramic handling arms, are primarily used in semiconductor equipment for transporting and transferring wafers. 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