Core Technical Advantages

✅ Ultra-High Thermal Conductivity – 150–200 W/m·K, 5–10× higher than alumina, enabling rapid heat dissipation

✅ Excellent Electrical Insulation – Volume resistivity ≥10¹⁴ Ω·cm, preventing cross-talk in high-voltage systems

✅ High-Temperature Stability – Stable up to 1800°C in inert atmosphere, resistant to thermal shock

✅ Precision Micro-Machining – Features fine grooves, holes, and flat surfaces with ±0.005mm tolerance

✅ Chemical Inertness & Cleanliness – Resistant to corrosion, no ion release

Key Applications

• Semiconductor Equipment:Wafer stage heat sinks, PVD/CVD system thermal carriers, MEMS packaging substrates
• Power Electronics: IGBT module substrates, LED high-power heat sinks, laser diode carriers
• Optical Instruments:Laser resonator heat management, high-power lens mounting plates
• Medical Devices: Diagnostic equipment heat sinks, high-voltage insulation substrates

Technical Support & Services

✅ Custom Design & Machining – Tailored microstructures, hole patterns, and surface finishes for specific thermal requirements

✅ Material Selection – High-purity AlN (≥99.5%), AlN-SiC composites, and metallized variants

✅ Surface Treatment – Precision lapping, metallization, and anti-oxidation coatings

✅ Quality Assurance – Thermal conductivity testing, CMM inspection, and cleanroom certification