Core Technical Advantages

✅ Excellent Thermal Conductivity – 150–200W/m·K, enabling efficient heat transfer in high-power electronics

✅ High Electrical Insulation –Volume resistivity ≥10¹⁴ Ω·cm, preventing electrical interference

✅ High-Temperature Stability –Stable up to 1800°C in inert atmosphere, resistant to thermal shock

✅ Chemical Inertness –Resistant to acids, alkalis, and corrosive gases, no ion release

✅ Precision Machining –Tolerances down to ±0.005mm, ensuring perfect fit in automated equipment

Key Applications

• Semiconductor Equipment:Wafer processing stage components, PVD/CVD system heat sinks
• Power Electronics: LED substrate carriers, IGBT module insulation spacers
• Optical Instruments: Laser resonator mounts, thermal management components
• Medical Devices: Diagnostic equipment heat sinks, high-voltage insulation parts

Technical Support & Services

✅ Custom Design & Machining – Tailored geometries, threads, and mounting features for specific equipment

✅ Material Selection – High-purity AlN (≥99.5%), AlN-SiC composites, and surface-coated variants

✅ Surface Treatment – Precision lapping, metallization, and anti-oxidation coatings

✅ Quality Assurance – Material purity reports, thermal conductivity testing, and CMM inspection