Core Technical Advantages

✅ Ultra-Precision Cutting

Maintains a cutting accuracy of ±0.002 mm, ensuring clean, narrow kerfs for high-density semiconductor packaging.

✅ Superior Wear Resistance

Outlasts traditional resin-bonded blades by 2–3x, reducing blade replacement frequency and production downtime.

✅ Low Thermal Damage

Excellent thermal conductivity dissipates cutting heat rapidly, preventing thermal damage to delicate wafer materials.

✅ High-Speed Stability

Dynamic balancing ensures stable operation at speeds up to 40,000 rpm, avoiding vibration-induced defects.

Key Application Scenarios

• Semiconductor Manufacturing：Silicon wafer, compound semiconductor (GaAs/InP) dicing
• LED & Optoelectronics：Sapphire substrate, ceramic substrate cutting
• Advanced Electronics：PCB (Printed Circuit Board) and ceramic package singulation
• Photovoltaics：Thin-film solar cell and wafer scribing

Technical Support & Services

✅ Expert Material Selection Consultation

Our engineering team provides tailored guidance to match the right ceramic blade material and specification to your cutting requirements.

✅ Custom Processing Solutions

We offer precision machining of blade diameter, thickness, and tooth geometry to optimize cutting performance for your specific materials.

✅ Full Quality Assurance Documentation

Every blade comes with dimensional inspection reports, material certification, and cutting performance test data, ensuring compliance with SEMI standards.