**Silicon Nitride Ceramic Heating Plate | Ceramic Components for Molding Presses**

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### Product Overview

Silicon nitride (Si₃N₄) ceramic heating plates are high-performance structural ceramic components specifically engineered for demanding applications in hot pressing and molding equipment—such as those used in powder metallurgy, technical ceramics, and composite material manufacturing. Leveraging the exceptional properties of silicon nitride, these heating plates deliver outstanding mechanical strength, thermal stability, and electrical insulation even under extreme operating conditions, making them a superior alternative to conventional metal or alumina-based heating elements.

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### Key Advantages

– **High Strength & Toughness**: Silicon nitride exhibits among the highest flexural strength and fracture toughness of all engineering ceramics, enabling reliable performance under repeated thermal cycling and mechanical loads.
– **Excellent Thermal Shock Resistance**: Maintains structural integrity during rapid heating and cooling cycles—ideal for both batch and continuous hot-pressing processes.
– **Low Coefficient of Thermal Expansion**: Ensures dimensional stability and minimizes warping or cracking caused by thermal stress.
– **Good Thermal Conductivity**: Higher than most insulating ceramics (e.g., alumina), promoting uniform heat distribution and improved heating efficiency.
– **Superior Electrical Insulation**: Retains high resistivity even at elevated temperatures, ensuring operational safety.
– **Corrosion & Oxidation Resistance**: Stable in air or inert atmospheres at high temperatures, with no degradation over prolonged use.

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### Typical Applications

– Heating plates in powder metallurgy hot presses
– Mold components for sintering technical ceramics and cemented carbides
– Hot press platens for composite materials (e.g., carbon fiber-reinforced polymers)
– Insulated heating substrates in semiconductor packaging equipment
– Core components in industrial or laboratory high-temperature pressing systems

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### Typical Technical Specifications

| Property | Value |
|——–|——-|
| Material | Reaction-bonded or hot-pressed silicon nitride (Si₃N₄) |
| Density | ≥3.2 g/cm³ |
| Flexural Strength | 700–1000 MPa |
| Fracture Toughness (K) | 6–8 MPa·m¹/² |
| Thermal Conductivity | 20–30 W/(m·K) |
| Coefficient of Thermal Expansion (25–800°C) | ~3.0 × 10⁻⁶ /K |
| Maximum Service Temperature | Up to 1400°C (in air, depending on grade and load) |

*Note: Specifications may vary based on manufacturing process and customer requirements. Custom shapes, dimensions, embedded heating elements, and surface finishes are available upon request.*