Ceramic Dicing Blade | Semiconductor Wafer Cutting Component | Semiconductor Industry
제품 개요
This high-performance ceramic dicing blade is engineered for precision cutting of semiconductor wafers, LED substrates, and advanced electronic components. Made from a composite ceramic material, it delivers exceptional wear resistance, cutting accuracy, and thermal stability, ensuring clean, damage-free cuts at high rotational speeds.
As a critical component in semiconductor packaging and processing equipment, it minimizes chipping and micro-cracks on wafer edges, directly enhancing the yield and reliability of your electronic products.
기술 지원 및 서비스
- 재료 선택 기술 상담 및 솔루션 제공
- 최대 ±0.01mm의 정밀도로 고객 요구 사항에 따른 맞춤형 가공
- 제품 검사 보고서 및 자재 인증 제공
제품 상세 사양
Core Technical Advantages
✅ Ultra-Precision Cutting
Maintains a cutting accuracy of ±0.002 mm, ensuring clean, narrow kerfs for high-density semiconductor packaging.
✅ Superior Wear Resistance
Outlasts traditional resin-bonded blades by 2–3x, reducing blade replacement frequency and production downtime.
✅ Low Thermal Damage
Excellent thermal conductivity dissipates cutting heat rapidly, preventing thermal damage to delicate wafer materials.
✅ High-Speed Stability
Dynamic balancing ensures stable operation at speeds up to 40,000 rpm, avoiding vibration-induced defects.
Key Application Scenarios
- Semiconductor Manufacturing：Silicon wafer, compound semiconductor (GaAs/InP) dicing
- LED & Optoelectronics：Sapphire substrate, ceramic substrate cutting
- Advanced Electronics：PCB (Printed Circuit Board) and ceramic package singulation
- Photovoltaics：Thin-film solar cell and wafer scribing
Technical Support & Services
✅ Expert Material Selection Consultation
Our engineering team provides tailored guidance to match the right ceramic blade material and specification to your cutting requirements.
✅ Custom Processing Solutions
We offer precision machining of blade diameter, thickness, and tooth geometry to optimize cutting performance for your specific materials.
✅ Full Quality Assurance Documentation
Every blade comes with dimensional inspection reports, material certification, and cutting performance test data, ensuring compliance with SEMI standards.
고급 세라믹
고급 세라믹 제품군은 각기 다른 특성을 지닌 다양한 소재를 포함하며, 각 소재는 특정 애플리케이션 시나리오에 맞게 특별히 설계되었습니다.
세라믹 소재
주요 적용 분야
여러 하이엔드 제조 분야에서 널리 사용되어 고객에게 맞춤형 솔루션을 제공합니다.
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왜 동관 XYC 신소재 유한공사 Is Your Premier Partner for Advanced Ceramics & Tungsten Carbides
Founded in 2009, we are a leading manufacturer of advanced ceramics and tungsten carbide. We deliver precision components to 1,000+ global customers in semiconductor, automotive, medical, and energy sectors.
핵심 이점
Diverse Materials & Products
Alumina, Zirconia, Silicon Nitride, Silicon Carbide, Aluminum Nitride, and high-performance tungsten carbide; 10,000+ custom component forms, 8 million+ precision components annual output.
Ultra-High Precision & Durability
±0.001 mm machining accuracy; Ceramics resist 1800°C heat and corrosion; Tungsten steel delivers superior wear resistance.
Tailored Cross-Industry Solutions
End-to-end support from material selection to mass production, available for both small-batch prototyping and large-scale orders.
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