Alumina Ceramic Microporous Chuck | Semiconductor Wafer & Chip | Vacuum Chuck | Wear-Resistant Porous Ceramic

제품 개요

기술 지원 및 서비스

  • 재료 선택 기술 상담 및 솔루션 제공
  • 최대 ±0.01mm의 정밀도로 고객 요구 사항에 따른 맞춤형 가공
  • 제품 검사 보고서 및 자재 인증 제공

제품 상세 사양

Product Description

Alumina Ceramic Microporous Chuck | Semiconductor Wafer & Chip | Vacuum Chuck | Wear-Resistant Porous Ceramic
Crafted from high-purity alumina (Al₂O₃ content ≥99.5%) via precision molding and high-temperature sintering processes, XYC’s alumina ceramic microporous vacuum chucks are engineered as high-performance core components for semiconductor wafer and chip manufacturing, handling, and processing workflows.
Featuring a uniform, interconnected microporous structure, these chucks deliver stable, non-damaging vacuum adsorption—ensuring secure, flat holding of ultra-thin semiconductor wafers, silicon chips, and fragile substrates without causing surface scratches or contamination. Unlike traditional metal or plastic chucks, our porous ceramic vacuum chucks boast exceptional wear resistance (hardness up to HRA 88–92, second only to diamond), superior chemical stability, and high-temperature resistance (sustains long-term operation at 1200°C). They resist corrosion from semiconductor process chemicals, plasmas, and cleaning agents, maintaining consistent porosity and adsorption performance even in harsh production environments.
Precision-machined to meet strict semiconductor industry tolerances, the chuck surface achieves ultra-high flatness (≤0.005mm) and smoothness (Ra ≤0.2μm), perfectly matching the dimensional accuracy requirements of wafers and chips of various sizes. The microporous structure is customizable—with adjustable pore size (0.5–5μm) and porosity (20–40%)—to adapt to different vacuum pressure demands and substrate materials, ensuring optimal adsorption force and release efficiency.
Our alumina ceramic microporous vacuum chucks are designed to enhance process stability and yield in semiconductor manufacturing steps such as wafer dicing, lithography, etching, and chip packaging. They are non-magnetic, non-conductive, and free of metal ion contamination, making them ideal for high-precision, cleanroom-compatible semiconductor production applications.
Backed by strict quality control throughout the production cycle—from raw material selection to final precision inspection—we offer customizable solutions including tailored sizes, special surface treatments, and porosity optimization to meet the unique requirements of semiconductor equipment manufacturers worldwide.

핵심 이점

  1. Uniform Microporous Structure

    Uniform pore distribution ensures balanced vacuum adsorption, preventing wafer warpage or slippage during high-speed processing.

  2. Superior Wear & Corrosion Resistance

    Resists mechanical abrasion and chemical corrosion from semiconductor process fluids, extending service life and reducing maintenance costs.

  3. High-Precision Dimensional Accuracy

    Ultra-flat surface and tight tolerance control guarantee seamless compatibility with semiconductor wafers and chips of various specifications.

  4. Cleanroom Compatibility

    Non-contaminating, non-outgassing material properties meet ISO Class 5 cleanroom standards, avoiding particle pollution in semiconductor manufacturing.

Typical Technical Parameters

매개변수 Specification
재료 99.5%+ High-Purity Alumina (Al₂O₃)
Pore Size 0.5–5 μm (customizable)
다공성 20–40% (adjustable)
Surface Flatness ≤0.005 mm
경도 HRA 88–92; Mohs Hardness 9.0
Max Service Temperature 1200°C
Chemical Stability Resistant to acids, alkalis, plasmas, and semiconductor process chemicals
Customizable Sizes Diameter: 50–500 mm; Thickness: 10–50 mm

애플리케이션

  • Semiconductor wafer handling, dicing, lithography, and etching processes
  • Silicon chip packaging and testing equipment
  • Flat panel display (FPD) substrate processing
  • Optical component manufacturing and precision positioning
We provide comprehensive pre-sales technical consultation and after-sales support. Contact our team to get customized solutions for your semiconductor production needs.

고급 세라믹

고급 세라믹 제품군은 각기 다른 특성을 지닌 다양한 소재를 포함하며, 각 소재는 특정 애플리케이션 시나리오에 맞게 특별히 설계되었습니다.

세라믹 소재

알루미나 세라믹
가장 인기 있는

알루미나 세라믹(Al₂O₃)

알루미나는 가장 널리 사용되는 고급 세라믹 소재로 전기 절연성이 뛰어납니다, 높은 경도 및 우수한 내마모성을 제공합니다. 최대 1700°C의 온도에서 작동할 수 있어 다양한 산업 분야에 다양한 산업 분야에 적합합니다.

온도 저항: 최대 1700°C
전기 절연: 우수
경도: 9 Mohs

주요 적용 분야

여러 하이엔드 제조 분야에서 널리 사용되어 고객에게 맞춤형 솔루션을 제공합니다.

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동관 XYC 신소재 유한공사 Is Your Premier Partner for Advanced Ceramics & Tungsten Carbides

Founded in 2009, we are a leading manufacturer of advanced ceramics and tungsten carbide. We deliver precision components to 1,000+ global customers in semiconductor, automotive, medical, and energy sectors.

핵심 이점

Diverse Materials & Products

Alumina, Zirconia, Silicon Nitride, Silicon Carbide, Aluminum Nitride, and high-performance tungsten carbide; 10,000+ custom component forms, 8 million+ precision components annual output.

Ultra-High Precision & Durability

±0.001 mm machining accuracy; Ceramics resist 1800°C heat and corrosion; Tungsten steel delivers superior wear resistance.

Tailored Cross-Industry Solutions

End-to-end support from material selection to mass production, available for both small-batch prototyping and large-scale orders.

고급 세라믹 부품
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