Semiconductor Industry Success Case

Providing high-precision ceramic components for semiconductor manufacturing, improving production efficiency and product quality. Common materials for vacuum chucks include alumina and microporous ceramics, with a hollow internal structure. By applying negative pressure to the porous substrate, it adsorbs and fixes the workpiece. This integrated hollow structure ceramic preparation process has high technical barriers, mainly used as processing fixtures for wafer thinning procedures (grinders, polishers, CMP), various types of measurement and inspection equipment fixtures, and processing fixtures for thin films and metal substrates.

Semiconductor Ceramic Product Cases

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Case Background and Challenges

With the continuous advancement of semiconductor manufacturing processes, the requirements for precision, stability, and reliability of production equipment are becoming increasingly high. Our client is a leading global semiconductor equipment manufacturer facing a series of issues caused by using traditional metal components in extreme environments (high temperature, high corrosion, high precision).

Semiconductor devices have very strict requirements for wafers. Only nearly perfect wafers can avoid electrically and mechanically harmful defects to the devices, so wafers need to go through multiple steps such as shaping, slicing, grinding, and cleaning. In these processes, wafers need a worktable for placement and fixation. Ceramic vacuum chucks, which are ceramics with a large number of interconnected or closed uniform solid or vacuum structures generated through high-temperature sintering, are used to fix workpieces such as semiconductor wafers and glass substrates through vacuum suction.

  • Insufficient thermal stability in high-temperature environments leads to decreased equipment precision
  • Chemical corrosion leads to short component lifespan, increasing maintenance costs and downtime
  • Metal particle contamination affects semiconductor yield
  • Component precision requirements reach sub-micron level
Ceramic Components in Semiconductor Manufacturing Equipment
Wafer Handling Finger

Wafer Handling Finger

Product Features/PRODUCT FEATURES

  • High Airtightness

    High airtightness

  • Corrosion, Wear, and High Temperature Resistant

    Resistant to corrosion, wear, and high temperatures

  • Insulation/Anti-static

    Insulation/anti-static

  • High Machining Precision

    High machining precision

Customized Ceramic Solutions

Based on customer needs, we have developed a series of high-precision ceramic components, using advanced material formulas and precision processing techniques, to provide ideal solutions for semiconductor manufacturing

High-temperature Ceramic Wafer Carrier

Using silicon nitride-based ceramic material, it maintains stable dimensions in 1200°C high-temperature environments, with extremely low thermal expansion coefficient, effectively preventing wafer deformation and improving yield.

Corrosion-resistant Ceramic Reaction Chamber Components

Using high-purity alumina and zirconia composite materials, it has excellent chemical inertness, effectively resisting plasma corrosion, and extending service life by more than 3 times.

High-precision Ceramic Positioning Components

Through precision grinding and polishing processes, it achieves ±0.5μm dimensional accuracy and Ra<10nm surface roughness, meeting the positioning requirements of advanced processes.

Semiconductor Manufacturing Process and Ceramic Applications

We provide professional ceramic solutions for key process links in semiconductor manufacturing, ensuring the stability and reliability of each process

Manufacturing Process Equipment Using Ceramic Products Advanced Ceramic Material Components Main Material Types
Lithography Lithography Machine Ceramic worktable, guide rail, mirror, ceramic chuck, arm, water-cooled plate, chuck Alumina, Silicon Nitride, Silicon Carbide
Etching Etching Machine Ring cylinder type, gas guide type, load-bearing fixed type, gripper gasket type, guide rail, module Zirconia, Alumina, Silicon Carbide
Thin Film Deposition PVD, CVD and ALD Equipment Ring cylinder type, gas guide type, load-bearing fixed type, gripper gasket type, module Zirconia, Alumina, Silicon Carbide
Ion Implantation Ion Implantation Equipment Ring cylinder type, load-bearing fixed type, gripper gasket type Zirconia, Alumina, Silicon Carbide
Coating and Development Lithography Machine, Coating and Development Equipment Load-bearing fixed type, gripper gasket type Alumina, Silicon Carbide
Oxidation/Diffusion, Annealing, Alloying, etc. Oxidation and Diffusion Equipment Load-bearing fixed type, gripper gasket type, module Alumina

Ceramic Component Applications in Key Equipment

Ceramic Components in Lithography Machine

Lithography Machine

Core ceramic components: Precision positioning worktable, mirror system, vacuum chuck, requiring extremely high flatness and thermal stability.

Ceramic Components in Etching Machine

Etching Machine

Core ceramic components: Reaction chamber inner wall, gas distributor, electrode base, requiring excellent corrosion resistance and high-temperature stability.

Ceramic Components in Thin Film Deposition Equipment

Thin Film Deposition Equipment

Core ceramic components: Crucible, evaporation source, gas nozzle, requiring high purity, low volatility and excellent thermal cycle stability.

Rigorous Project Implementation Process

From requirement analysis to final delivery, we follow a strict quality management system to ensure each ceramic component meets the customer's high standards

1

Requirement Analysis and Material Selection

Our engineering team communicates deeply with customers, analyzes usage environments and technical requirements, selects the most suitable ceramic material combination, and conducts preliminary performance evaluation and simulation tests.

2

Precision Mold Design and Manufacturing

Based on 3D modeling and finite element analysis, we design high-precision molds and use CNC machining technology to ensure mold precision, laying the foundation for subsequent forming processes.

3

Forming and Sintering Process

We use isostatic pressing technology to ensure uniform green body density and conduct high-temperature sintering in a strictly controlled atmosphere furnace to ensure the material achieves optimal performance.

4

Precision Machining and Surface Treatment

Using advanced CNC machining centers and ultra-precision grinding equipment, combined with proprietary processes, we achieve sub-micron precision machining to ensure surface quality meets requirements.

5

Strict Quality Inspection

We conduct comprehensive inspections through advanced equipment such as coordinate measuring machines, laser interferometers, and scanning electron microscopes to ensure each component meets technical specifications.

Project Results and Customer Benefits

Equipment Service Life Improvement +245%
Maintenance Cost Reduction -68%
Production Yield Improvement +15.3%
Equipment Downtime Reduction -72%

Customer Feedback

"

XYC Ceramics' high-precision ceramic components have completely solved the material corrosion and precision instability issues we faced in semiconductor manufacturing. The equipment maintenance frequency has been significantly reduced, and both production efficiency and product yield have been greatly improved. We are deeply impressed by their professional technical support and customized services.

Customer Representative

Engineer Zhang

R&D Director | A Semiconductor Equipment Manufacturer

Semiconductor-specific Ceramic Core Products

We provide high-precision, high-performance ceramic core components for semiconductor manufacturing to ensure the stability and reliability of the production process

Ceramic Vacuum Chuck

Ceramic Vacuum Chuck

Ceramic vacuum chuck is a special vacuum chuck made of porous ceramic materials, with high porosity, high strength, high flatness and other characteristics, widely used in semiconductor wafer cutting, grinding, inspection and other processes.

Core Performance Features:

  • Self-sealing Test:Turn off the vacuum source, negative pressure from -85Kpa to -80Kpa, duration up to 60s or more
  • Wafer Adsorption Test:Turn off the vacuum source, negative pressure from -80Kpa to -25Kpa, duration up to 35s or more
  • High Precision:Excellent flatness and parallelism, meeting sub-micron level positioning requirements
  • Good Air Tightness:Uniform pore distribution, ensuring stable vacuum adsorption effect
  • Good High Temperature Resistance:Can work stably in high temperature environments, no deformation, no aging
  • Controllable Surface Resistivity:Effectively prevents static accumulation, protects sensitive wafer surfaces

Semiconductor Equipment Ceramic Components

The advanced ceramic material components used by the company in semiconductor equipment are mainly applied inside the chamber, and some of them are in direct contact with wafers, which are key precision components in integrated circuit manufacturing.

Application Features:

  • High-purity materials, no metal ion contamination, ensuring a clean wafer manufacturing environment
  • Excellent chemical corrosion resistance, resisting various process gases and plasma erosion
  • Extremely low particle shedding rate, meeting ultra-clean room environment requirements
  • Precise dimensional control, meeting sub-micron assembly tolerance requirements
Semiconductor Equipment Ceramic Components
Ceramic Robotic Arm

Ceramic Robotic Arm

Used for transferring wafers and LEDs throughout the production process, effectively preventing wafer scratches and surface contamination. Ceramic robotic arms are made of advanced ceramic materials, featuring excellent rigidity, lightweight characteristics, and chemical stability.

Key Advantages:

No metal ion contamination, ensuring product purity
Ultra-smooth surface, preventing wafer scratches
Lightweight design, improving motion speed and precision
Excellent rigidity, ensuring high-speed operation stability
Chemical corrosion resistance, long service life
Non-magnetic, avoiding interference with electronic components

Advanced Precision Manufacturing

XYC has over 20 years of precision processing experience!

We are equipped with a large number of processing equipment, covering various high-precision processing equipment at home and abroad, capable of handling the processing of various complex workpieces.

Precision Manufacturing Equipment

Raw Material Preparation

RAW MATERIAL PREPARATION

XYC has its own material R&D production line and can conduct production and sintering according to different materials and sizes!

XYC has its own material R&D production line and can conduct production and sintering according to different materials and sizes!

Precision Inspection

PRECISION INSPECTION

XYC has IQC, IPQC, and OQC departments, and owns multiple imported high-precision inspection equipment, which can meet various industry standard inspection requirements, such as Zeiss coordinate measuring machine, CCD, SEM, etc.

XYC Advantages

01

R&D Strength

The company has an R&D team led by well-known professors and doctors in the ceramic materials industry, with more than 30 professional and technical personnel, and also receives strong R&D support from research institutes and university-enterprise cooperation.

02

Powder Formula

With multiple material doctors and rich application case experience, we can develop formulas according to customer needs to meet customer requirements.

03

Forming and Sintering

We have various forming and sintering equipment, which can perform corresponding forming and sintering according to different material requirements.

04

Precision Processing Strength

With more than 20 years of precision processing experience, we have complete processing equipment for each process and can customize solutions according to customer requirements in depth.

05

High Quality Assurance

The company has IQC, IPQC, and OQC departments, and owns multiple high-precision testing equipment to strictly control quality, which can meet various industry standard testing requirements.

06

Complete Industrial Chain

The company has a complete closed-loop industrial chain, from formula → forming → sintering → precision manufacturing → high-clean cold surface treatment → solution testing, all completed by our company.

Need Semiconductor Ceramic Solutions?

Whatever challenges you face, we can provide you with customized ceramic solutions. Contact us immediately to start cooperation!

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